CPZ28 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – 0.5 Watt Zener Diode Chip

PROCESS CPZ28
Zener Diode
0.5 Watt Zener Diode Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
EPITAXIAL PLANAR
13 x 13 MILS
7.8 MILS
7.0 x 7.0 MILS
Ti/Al - 13,000Å
Au-As - 13,000Å
GEOMETRY
GROSS DIE PER 5 INCH WAFER
101,184
PRINCIPAL DEVICE TYPES
CMPZ5221B
THRU
CMPZ5267B
R0
BACKSIDE CATHODE
w w w. c e n t r a l s e m i . c o m
R2 (22-March 2010)