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CPZ25 Datasheet, PDF (1/1 Pages) Central Semiconductor Corp – Zener Diodes 1.5 W Zener Diode Chip
PROCESS CPZ25
Zener Diodes
1.5 W Zener Diode Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
ANODE
EPITAXIAL PLANAR
33.5 X 33.5 MILS
8.0 MILS
23 X 23 MILS
Al - 30,000Å
Au - 12,000Å
GROSS DIE PER 4 INCH WAFER
10,070
PRINCIPAL DEVICE TYPES
1N5913B
THRU
1N5956B
BACKSIDE CATHODE R0
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R0 (20-June 2002)