CPZ19_10 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Zener Diode 0.5 Watt Zener Diode Chip

PROCESS CPZ19
Zener Diode
0.5 Watt Zener Diode Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
EPITAXIAL PLANAR
17.7 x 17.7 MILS
7.5 MILS
11 x 11 MILS
Al - 13,000Å
Au - 14,000Å
GEOMETRY
GROSS DIE PER 4 INCH WAFER
36,642
PRINCIPAL DEVICE TYPES
CMPZ5235B
THRU
CMPZ5261B
BACKSIDE CATHODE
w w w. c e n t r a l s e m i . c o m
R5 (22-March 2010)