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CPZ19 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Zener Diode 0.5 Watt Zener Diode Chip
PROCESS CPZ19
Zener Diode
0.5 Watt Zener Diode Chip
CentralTM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
18 X 18 MILS
7.5 MILS
11 X 11 MILS
Al - 30,000Å
Au - 14,000Å
GROSS DIE PER 4 INCH WAFER
36,600
PRINCIPAL DEVICE TYPES
CMPZ5235B
THRU
CMPZ5261B
BACKSIDE CATHODE
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: (631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com
R2 (1-August 2002)