CPZ18_10 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Zener Diode 0.5 Watt Zener Diode Chip

PROCESS CPZ18
Zener Diode
0.5 Watt Zener Diode Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
EPITAXIAL PLANAR
13.8 x 13.8 MILS
7.5 MILS
7.5 x 7.5 MILS
Al - 13,000Å
Au - 14,000Å
GEOMETRY
GROSS DIE PER 4 INCH WAFER
61,141
PRINCIPAL DEVICE TYPES
CMPZ5221B
THRU
CMPZ5234B
BACKSIDE CATHODE
w w w. c e n t r a l s e m i . c o m
R6 (22-March 2010)