CPZ18 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Zener Diode 0.5 Watt Zener Diode Chip

PROCESS CPZ18
Zener Diode
0.5 Watt Zener Diode Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
14 X 14 MILS
7.5 MILS
9.5 X 9.5 MILS
Al - 30,000Å
Au - 14,000Å
GROSS DIE PER 4 INCH WAFER
61,141
PRINCIPAL DEVICE TYPES
CMPZ5221B
THRU
CMPZ5234B
BACKSIDE CATHODE
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R2 (1-August 2002)