CPS130 Datasheet, PDF (1/1 Pages) Central Semiconductor Corp – Silicon Controlled Rectifier 16 Amp Sensitive Gate SCR Chip

PROCESS CPS130
Silicon Controlled Rectifier
16 Amp Sensitive Gate SCR Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Cathode Bonding Pad Area
Gate Bonding Pad Area
Top Side Metalization
Back Side Metalization
Glass Passivated Mesa
130 x 130 MILS
8.7 MILS
99 x 49 MILS
42 x 42 MILS
Al - 45,000Å
Al/Mo/Ni/Ag - 32,000Å
GEOMETRY
GROSS DIER PER 4 INCH WAFER
624
PRINCIPAL DEVICE TYPES
CS220-16M Series
CSDD-16M Series
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R0 (4- January 2006)