CPQ150 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Triac 12 Amp, 600 Volt Triac Chip

PROCESS CPQ150
Triac
16 Amp, 600 Volt Triac Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
MT1 Bonding Pad Area
Gate Bonding Pad Area
Top Side Metalization
Back Side Metalization
GLASS PASSIVATED MESA
150 MILS x 150 MILS
8.6 MILS ± 0.6 MILS
68.9 MILS x 118 MILS
39.4 MILS x 39.4 MILS
Al - 45,000Å
Al/Mo/Ni/Ag - 32,000Å
GEOMETRY
GROSS DIE PER 4 INCH WAFER
466
PRINCIPAL DEVICE TYPES
CQ220-16B Series
CQDD-16M Series
BACKSIDE MT2
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R1 (19 -May 2005)