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| CPD96V_10 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Schottky Diode 500mA Low VF Schottky Diode Chip | |||
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PROCESS CPD96V
Schottky Diode
500mA Low VF Schottky Diode Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
EPITAXIAL PLANAR
20 x 20 MILS
7.1 MILS
16.4 x 16.4 MILS
Al - 20,000Ã
Au - 12,000Ã
GEOMETRY
GROSS DIE PER 4 INCH WAFER
28,028
PRINCIPAL DEVICE TYPES
CMLSH05-4
w w w. c e n t r a l s e m i . c o m
R5 (22-March 2010)
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