CPD96V Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Schottky Diode 500mA Low VF Schottky Diode Chip

PROCESS CPD96V
Schottky Diode
500mA Low VF Schottky Diode Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
ANODE
EPITAXIAL PLANAR
20 x 20 MILS
7.1 MILS
16 x 16 MILS
Al - 20,000Å
Au - 12,000Å
GROSS DIE PER 4 INCH WAFER
28,028
PRINCIPAL DEVICE TYPES
CMLSH05-4
R0
BACKSIDE CATHODE
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R3 (15-March 2006)