CPD94X Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – 0.5 Amp Schottky Diode Chip

PROCESS CPD94X
Schottky Diode
0.5 Amp Schottky Diode Chip
PROCESS DETAILS
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
20 x 20 MILS
5.9 MILS
16 x 16 MILS
Al - 20,000Å
Au - 12,000Å
GEOMETRY
GROSS DIE PER 5 INCH WAFER
42,213
PRINCIPAL DEVICE TYPES
CMDSH05-4
CMLSH05-4
CMPSH05-4
w w w. c e n t r a l s e m i . c o m
R0 (19-July 2010)