CPD92 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Schottky Diode High Voltage Schottky Diode Chip

PROCESS CPD92
Schottky Diode
High Voltage Schottky Diode Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
9.0 x 9.0 MILS
7.9 MILS
4.8 MILS DIAMETER
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
139,050
PRINCIPAL DEVICE TYPES
CMDD6263
CMKD6263
CMOD6263
CMPD6263 SERIES
CMSD6263 SERIES
1N6263
BACKSIDE CATHODE
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R1 (1-August 2002)