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CPD91V_10 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Switching Diode Low Leakage Switching Diode Chip
PROCESS CPD91V
Switching Diode
Low Leakage Switching Diode Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
EPITAXIAL PLANAR
11 x 11 MILS
7.1 MILS
3.35 x 3.35 MILS
Al - 15,000Å
Au-As - 12,000Å
GEOMETRY
GROSS DIE PER 5 INCH WAFER
137,880
PRINCIPAL DEVICE TYPES
CMPD6001 Series
CMOD6001
CMLD6001
CMLD6001DO
CMDD6001
w w w. c e n t r a l s e m i . c o m
R2 (3-August 2010)