CPD91 Datasheet, PDF (1/1 Pages) Central Semiconductor Corp – Switching Diode Low Leakage Switching Diode Chip

PROCESS CPD91
Switching Diode
Low Leakage Switching Diode Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
11 x 11 MILS
9.1 MILS
3.4 x 3.4 MILS
Al - 15,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
94,130
PRINCIPAL DEVICE TYPES
CMPD6001 Series
CMOD6001
CMLD6001
CMLD6001DO
CMDD6001
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R0 (20- January 2006)