CPD87R Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Low Leakage Schottky Diode Chip

PROCESS CPD87R
Schottky Diode
Low Leakage Schottky Diode Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
EPITAXIAL PLANAR
14.6 x 14.6 MILS
3.9 MILS
11.8 x 11.8 MILS
Al - 30,000Å
Au - 12,000Å
GEOMETRY
GROSS DIE PER 5 INCH WAFER
80,698
PRINCIPAL DEVICE TYPES
CFSH2-4L
w w w. c e n t r a l s e m i . c o m
R1 (22-March 2010)