CPD82X Datasheet, PDF (1/1 Pages) Central Semiconductor Corp – Schottky Diode High Current, Low VF Schottky Diode Chip

PROCESS CPD82X
Schottky Diode
High Current, Low VF Schottky Diode Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
14.6 x 14.6 MILS
5.5 MILS
11.8 x 11.8 MILS
Al - 30,000Å
Au - 12,000Å
GROSS DIE PER 4 INCH WAFER
52,965
PRINCIPAL DEVICE TYPES
CMDSH2-3
CMDSH2-4L
CMOSH2-4L
CMUSH2-4L
CMKSH2-4L
CMXSH2-4L
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R0 (20- January 2006)