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| CPD81 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Schottky Rectifier 5 Amp Schottky Barrier Rectifier Chip | |||
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PROCESS CPD81
Schottky Rectifier
5 Amp Schottky Barrier Rectifier Chip
PROCESS DETAILS
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
72.5 x 72.5 MILS
11.8 MILS
63.8 x 63.8 MILS
Al - 30,000Ã
Au - 18,000Ã
GEOMETRY
GROSS DIE PER 4 INCH WAFER
2,178
PRINCIPAL DEVICE TYPES
CZSH5-40
CZSH10-40CN (Dual Chip)
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: (631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com
R0 (13 -August 2004)
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