CPD79 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – 2 Amp Schottky Rectifier Chip

PROCESS CPD79
Schottky Rectifier
2 Amp Schottky Rectifier Chip
PROCESS DETAILS
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
49 x 49 MILS
9.8 MILS
39 x 39 MILS
Al/Ni/Au - 30,000Å/3,000Å/1,500Å
Ti/Ni/Au - 1,600Å/5,500Å/1,600Å
GEOMETRY
GROSS DIE PER 4 INCH WAFER
4,608
PRINCIPAL DEVICE TYPE
CTLSH2-40M832
w w w. c e n t r a l s e m i . c o m
R0 (19-July 2010)