CPD76X Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – 1 Amp Schottky Diode Chip

PROCESS CPD76X
Schottky Diode
1 Amp Schottky Diode Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
EPITAXIAL PLANAR
32 x 32 MILS
5.9 MILS
27 x 27 MILS
Al - 20,000Å
Au - 12,000Å
GEOMETRY
GROSS DIE PER 5 INCH WAFER
16,276
PRINCIPAL DEVICE TYPES
CMLSH1-40
CXSH-4
CTLSH1-40M832D
w w w. c e n t r a l s e m i . c o m
R2 (22-March 2010)