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| CPD76V Datasheet, PDF (1/1 Pages) Central Semiconductor Corp – Schottky Diode 1.0A Schottky Diode Chip | |||
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PROCESS CPD76V
Schottky Diode
1.0A Schottky Diode Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
32 x 32 MILS
7.1 MILS
26 x 26 MILS
Al - 20,000Ã
Au - 12,000Ã
GROSS DIE PER 4 INCH WAFER
10,915
PRINCIPAL DEVICE TYPES
CMLSH1-40
1N5817
1N5818
1N5819
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: (631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com
R0 (8 -April 2005)
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