CPD74_10 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Switching Diode Monolithic Isolated Quad Switching Diode Chip

PROCESS CPD74
Switching Diode
Monolithic Isolated Quad Switching Diode Chip
PROCESS DETAILS
Die Size
25 x 25 MILS
Die Thickness
6.0 MILS
Anode 1, 2, 3, 4 Bonding Pad Area 3.5 x 4.0 MILS
Cathode 1, 2, 3, 4 Bonding Pad Area 3.5 x 4.0 MILS
Top Side Metalization
Al - 12,000Å
Back Side Metalization
Au - 5,000Å
GEOMETRY
GROSS DIE PER 3 INCH WAFER
10,000
PRINCIPAL DEVICE TYPES
CMEDA-6i
w w w. c e n t r a l s e m i . c o m
R2 (22-March 2010)