CPD71 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Low Leakage Diode Low Leakage Switching Diode Chip

PROCESS CPD71
Low Leakage Diode
Low Leakage Switching Diode Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
11 x 11 MILS
11 MILS
3.3 x 3.3 MILS
Al - 15,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
94,130
PRINCIPAL DEVICE TYPES
CMPD6001
BACKSIDE CATHODE
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R1 (1-August 2002)