CPD69 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – 1 Amp Glass Passivated Rectifier Chip

PROCESS CPD69
General Purpose Rectifier
1 Amp Glass Passivated Rectifier Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GLASS PASSIVATED MESA
42.5 x 42.5 MILS
12.5 MILS
32 x 32 MILS
Ni/Au - 5,000Å/2,000Å
Ni/Au - 5,000Å/2,000Å
GEOMETRY
GROSS DIE PER 4 INCH WAFER
6,200
PRINCIPAL DEVICE TYPES
CMR1-02 Series
CMR1-02M Series
CXR1-04
CXR1-04C
CZR1-04
CZR1-04C
w w w. c e n t r a l s e m i . c o m
R5 (5-April 2011)