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| CPD66X Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Low Leakage Diode Low Leakage Diode Chip | |||
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PROCESS CPD66X
Low Leakage Diode
Low Leakage Diode Chip
PROCESS DETAILS
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
17.5 x 17.5 MILS
5.9 MILS
7.9 MILS DIAMETER
Al - 30,000Ã
Au-As - 13,000Ã
GEOMETRY
GROSS DIE PER 5 INCH WAFER
54,848
PRINCIPAL DEVICE TYPES
CMOD3003
CMLD3003DOG
CMPD3003A
CMPD3003C
CMPD3003S
w w w. c e n t r a l s e m i . c o m
R1 (19-July 2010)
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