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| CPD64 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Low Leakage Diode Low Leakage Diode Chip | |||
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PROCESS CPD64
Low Leakage Diode
Low Leakage Diode Chip
CentralTM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
17.5 x 17.5 MILS
8.0 MILS
8.0 MILS DIAMETER
Al - 30,000Ã
Au - 6,000Ã
GROSS DIE PER 4 INCH WAFER
36,890
PRINCIPAL DEVICE TYPES
CMPD3003
1N3595
BACKSIDE CATHODE
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: (631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com
R2 (1-August 2002)
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