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| CPD48V Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Schottky Diode High Current Schottky Diode Chip | |||
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PROCESS CPD48V
Schottky Diode
High Current Schottky Diode Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
14 x 14 MILS
7.1 MILS
9.0 x 9.0 MILS
Al - 30,000Ã
Au - 12,000Ã
GROSS DIE PER 4 INCH WAFER
62,250
PRINCIPAL DEVICE TYPES
CMPSH-3 Series
CMSSH-3 Series
CMXSH-3
CMKSH-3T
BACKSIDE CATHODE
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: (631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com
R0 (13- February 2006)
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