CPD38X Datasheet, PDF (1/1 Pages) Central Semiconductor Corp – 8 Amp Schottky Rectifier Chip

PROCESS CPD38X
Schottky Rectifier
8 Amp Schottky Rectifier Chip
PROCESS DETAILS
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
72 x 72 MILS
5.9 MILS
64 x 64 MILS
Al/Ni/Au - 30,000Å/4,000Å/1,500Å
Ti/Ni/Au - 1,600Å/5,550Å/1,500Å
GEOMETRY
GROSS DIE PER 5 INCH WAFER
3,137
w w w. c e n t r a l s e m i . c o m
R1 (29-April 2010)