CPD34X Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – 10 Amp Schottky Rectifier Chip

PROCESS CPD34X
Schottky Rectifier
10 Amp Schottky Rectifier Chip
PROCESS DETAILS
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
85 x 85 MILS
5.9 MILS ± 0.8 MILS
78 x 78 MILS
Al – 30,000Å
Ti/Ni/Au - 1,600Å/5,550Å/1,500Å
GEOMETRY
GROSS DIE PER 5 INCH WAFER
2,260
PRINCIPAL DEVICE TYPE
CSHD10-60
w w w. c e n t r a l s e m i . c o m
R0 (17-October 2011)