CPD24_10 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Fast Recovery Rectifier 1 Amp Glass Passivated Rectifi er Chip

PROCESS CPD24
Fast Recovery Rectifier
1 Amp Glass Passivated Rectifier Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GLASS PASSIVATED MESA
51 x 51 MILS
11 MILS
35 x 35 MILS
Ni/Au - 5,000Å/2,000Å
Ni/Au - 5,000Å/2,000Å
GEOMETRY
GROSS DIE PER 4 INCH WAFER
4,250
PRINCIPAL DEVICE TYPES
1N4933 thru 1N4937
1N4942 thru 1N4948
1N5615 thru 1N5623
CMR1F-02M Series
BACKSIDE CATHODE
R1
w w w. c e n t r a l s e m i . c o m
R3 (29-April 2010)