CPD18 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – ULTRA FAST RECTIFIER 8 Amp GLASS PASSIVATED RECTIFIER CHIP

PROCESS CPD18
Ultra Fast Rectifier
8 Amp Glass Passivated Rectifier Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
GLASS PASSIVATED MESA
98 x 98 MILS
12.2 MILS
82.5 x 82.5 MILS
Au - 5,000Å
Au - 2,000Å
GROSS DIE PER 4 INCH WAFER
1,170
PRINCIPAL DEVICE TYPES
1N5807 thru 1N5811
UES1301 thru UES1306
UES1401 thru UES1403
CUDD8-02 Series
BACKSIDE CATHODE
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R2 (19-September 2003)