CPD16 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Ultra Fast Rectifier 1.0 Amp Glass Passivated Rectifier Chip

PROCESS CPD16
Ultra Fast Rectifier
1.0 Amp Glass Passivated Rectifier Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
GLASS PASSIVATED MESA
50 x 50 MILS
12.2 MILS
34 x 34 MILS
Au - 5,000Å
Au - 2,000Å
GROSS DIE PER 4 INCH WAFER
4,520
PRINCIPAL DEVICE TYPES
UES1001 thru UES1003
UF4001 thru UF4007
CMR1U-01 Series
CMR1U-01M Series
BACKSIDE CATHODE
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R2 (19-September 2003)