CPD15 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – 500mA Glass Passivated Rectifier Chip

PROCESS CPD15
Ultra Fast Rectifier
500mA Glass Passivated Rectifier Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
GLASS PASSIVATED MESA
25 x 25 MILS
9.5 MILS
14.5 x 14.5 MILS
Au - 5,000Å
Au - 2,000Å
GROSS DIE PER 4 INCH WAFER
18,080
PRINCIPAL DEVICE TYPES
CBRHDU-02 Series
BACKSIDE CATHODE
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R2 (19-September 2003)