CPD107 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – 3 Amp Schottky Rectifier Chip

PROCESS CPD107
Schottky Rectifier
3 Amp Schottky Rectifier Chip
PROCESS DETAILS
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
56 x 56 MILS
11.8 MILS
51 x 51 MILS
Al - 30,000Å
Ag - 20,000Å
GEOMETRY
GROSS DIE PER 5 INCH WAFER
5,516
PRINCIPAL DEVICE TYPE
CZSH6-100C
w w w. c e n t r a l s e m i . c o m
R0 (1-March 2011)