CPD104R Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Schottky Diode Low VF Schottky Diode Chip

PROCESS CPD104R
Schottky Diode
Low VF Schottky Diode Chip
PROCESS DETAILS
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
14.6 x 14.6 MILS
3.9 MILS
11.8 x 11.8 MILS
Al - 30,000Å
Au - 12,000Å
GEOMETRY
GROSS DIE PER 5 INCH WAFER
80,698
PRINCIPAL DEVICE TYPES
CFSH2-3L
w w w. c e n t r a l s e m i . c o m
R0 (1-February 2011)