CPD102X Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Schottky Diode High Voltage Schottky Diode Chip

PROCESS CPD102X
Schottky Diode
High Voltage Schottky Diode Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
EPITAXIAL PLANAR
9.0 x 9.0 MILS
5.9 MILS
4.8 MILS DIAMETER
Al - 30,000Å
Au - 12,000Å
GEOMETRY
GROSS DIE PER 5 INCH WAFER
210,600
PRINCIPAL DEVICE TYPES
CMDD6263
CMKD6263
CMLD6263 Series
CMOD6263
CMPD6263 Series
CMSD6263 Series
CMUD6263E Series
1N6263
w w w. c e n t r a l s e m i . c o m
R0 (27-September 2010)