CPD04_10 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – General Purpose Rectifier 500mA Glass Passivated Rectifier Chip

PROCESS CPD04
General Purpose Rectifier
500mA Glass Passivated Rectifier Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Anode Bonding Pad Area
Top Side Metalization
Back Side Metalization
GLASS PASSIVATED MESA
26 x 26 MILS
8.5 MILS
14 x 14 MILS
Ni/Au - 5,000Å/2,000Å
Ni/Au - 5,000Å/2,000Å
GEOMETRY
GROSS DIE PER 4 INCH WAFER
18,000
PRINCIPAL DEVICE TYPES
1N645 thru 1N649
CBRHD-02 Series
w w w. c e n t r a l s e m i . c o m
R4 (22-March 2010)