CP792 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - Amp/Switch Transistor Chip

PROCESS CP792V
Small Signal Transistor
PNP - Amp/Switch Transistor Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
11 x 11 MILS
7.0 MILS
3.7 x 3.7 MILS
3.7 x 3.7 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
93,826
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
PRINCIPAL DEVICE TYPES
2N3906
CMKT3906
CMLT3906E
CMPT3906
CMPT3906E
CMST3906
CXT3906
CZT3906
R0
R1 (15 -April 2005)