CP788X Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - Low Noise Amplifier Transistor Chip

PROCESS CP788X
Small Signal Transistor
PNP - Low Noise Amplifier Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
13.7 x 13.7 MILS
5.9 MILS
4.0 x 4.0 MILS
5.5 x 5.5 MILS
Al-Si - 30,000Å
Au - 12,000Å
GROSS DIE PER 5 INCH WAFER
91,469
PRINCIPAL DEVICE TYPE
CMKT5087
BACKSIDE COLLECTOR R0
w w w. c e n t r a l s e m i . c o m
R1 (29-April 2010)