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CP782X Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - Low VCE(SAT) Transistor Chip | |||
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PROCESS CP782X
Small Signal Transistor
PNP - Low VCE(SAT) Transistor Chip
PROCESS DETAILS
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
26 x 26 MILS
5.9 MILS
5.5 x 5.5 MILS
5.5 x 5.5 MILS
Al - 30,000Ã
Au - 12,000Ã
GROSS DIE PER 5 INCH WAFER
25,536
PRINCIPAL DEVICE TYPES
CMLT7820G
CMPT7820
CXT7820
w w w. c e n t r a l s e m i . c o m
R0 (9-September 2010)
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