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| CP773 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – MOSFET Transistor P-Channel Enhancement-Mode MOSFET Chip | |||
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PROCESS CP773
MOSFET Transistor
P-Channel Enhancement-Mode MOSFET Chip
PROCESS DETAILS
Die Size
Die Thickness
Gate Bonding Pad Area
Source Bonding Pad Area
Top Side Metalization
Back Side Metalization
39 x 27 MILS
7.5 MILS
6.5 x 6.5 MILS
30 x 20 MILS
Al - 40,000Ã
Ti/Ni/Ag - 1,000Ã
/3,000Ã
/10,000Ã
GEOMETRY
GROSS DIE PER 8 INCH WAFER
43,500
PRINCIPAL DEVICE TYPES
CMPDM302PH
CTLDM304P-M832DS
w w w. c e n t r a l s e m i . c o m
R3 (24-February 2014)
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