CP767V Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - Low Noise Amplifier Transistor Chip

PROCESS CP767V
Small Signal Transistor
PNP - Saturated Switch Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
30 x 30 MILS
7.1 MILS
3.9 x 4.2 MILS
7.4 x 3.8 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 5 INCH WAFER
18,960
PRINCIPAL DEVICE TYPES
2N3467
2N3468
BACKSIDE COLLECTOR R0
w w w. c e n t r a l s e m i . c o m
R1 (29-April 2010)