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| CP767 Datasheet, PDF (1/1 Pages) Central Semiconductor Corp – Small Signal Transistor PNP- Saturated Switch Transistor Chip | |||
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PROCESS CP767
Small Signal Transistor
PNP- Saturated Switch Transistor Chip
PRELIMINARY
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
EPITAXIAL PLANAR
30 x 30 MILS
9.0 MILS
3.85 x 4.20 MILS
7.35 x 3.75 MILS
Al - 30,000Ã
Au - 15,000Ã
GEOMETRY
GROSS DIE PER 4 INCH WAFER
12,300
PRINCIPAL DEVICE TYPES
2N3467
2N3468
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: (631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com
R0 (24-June 2003)
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