CP763V Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Power Transistor PNP - High Current Transistor Chip

PROCESS CP763V
Power Transistor
PNP - High Current Transistor Chip
PROCESS DETAILS
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
48.8 x 48.8 MILS
7.1 MILS
7.9 x 7.9 MILS
9.1 x 18.1 MILS
Al - 30,000Å
Ti/Ni/Ag - 2,000Å/3,000Å/20,000Å
GROSS DIE PER 5 INCH WAFER
7,140
PRINCIPAL DEVICE TYPE
CZT955
w w w. c e n t r a l s e m i . c o m
R0 (2-August 2012)