CP753V_10 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistors PNP - High Current Transistor Chip

PROCESS CP753V
Small Signal Transistors
PNP - High Current Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter 1 Bonding Pad Area
Emitter 2 Bonding Pad Area
Top Side Metalization
Back Side Metalization
EPITAXIAL PLANAR
66 x 66 MILS
7.1 MILS
7.9 x 7.9 MILS
7.9 x 9.5 MILS
7.9 x 9.5 MILS
Al-Si - 30,000Å
Ti/Ni/Ag - 2,000Å/3,000Å/20,000Å
GEOMETRY
GROSS DIE PER 5 INCH WAFER
3,878
PRINCIPAL DEVICE TYPES
CZT953
w w w. c e n t r a l s e m i . c o m
R2 (22-March 2010)