CP736V Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistors PNP - High Voltage Transistor Chip

PROCESS CP736V
Small Signal Transistors
PNP - High Voltage Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
17.3 x 17.3 MILS
7.1 MILS
3.9 x 3.9 MILS
3.9 x 3.9 MILS
Al-Si - 30,000Å
Au - 12,000Å
GROSS DIE PER 5 INCH WAFER
57,735
PRINCIPAL DEVICE TYPES
CMUT5401
CMPT5401
CXT5401
w w w. c e n t r a l s e m i . c o m
R1 (17-May 2012)