CP734V_10 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistors PNP - Chopper Transistor Chip

PROCESS CP734V
Small Signal Transistors
PNP - Chopper Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
31.5 x 31.5 MILS
7.0 MILS
4.7 x 6.7 MILS
4.7 x 8.7 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 5 INCH WAFER
16,986
PRINCIPAL DEVICE TYPES
CMPT404A
MPS404A
w w w. c e n t r a l s e m i . c o m
R2 (22-March 2010)