CP734V Datasheet, PDF (1/1 Pages) Central Semiconductor Corp – Small Signal Transistors NPN - Amp Switch Transistor Chip

PROCESS CP734V
Small Signal Transistors
PNP - Chopper Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
Epitaxial Planar
31.5 x 31.5 MILS
7.1 MILS
4.7 x 6.7 MILS
4.7 x 8.7 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
11,210
PRINCIPAL DEVICE TYPES
CMPT404A
MPS404A
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R0 (5- January 2006)