CP720 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - High Current Transistor Chip

PROCESS CP720
Small Signal Transistor
PNP - High Current Transistor Chip
Central^TM
Semiconductor Corp.
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
22 x 22 MILS
9.0 MILS
5.7 X 4.0 MILS
5.3 X 4.0 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
22,400
PRINCIPAL DEVICE TYPES
MPSA55
MPSA56
BACKSIDE COLLECTOR
145 Adams Avenue
Hauppauge, NY 11788 USA
Tel: [phone]
Fax: [phone]
www.centralsemi.com
R3 (21-September 2003)