CP716V_10 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistors PNP - High Voltage Transistor Chip

PROCESS CP716V
Small Signal Transistors
PNP - High Voltage Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
19.7 x 19.7 MILS
7.1 MILS
4.0 x 4.0 MILS
4.7 x 4.7 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 4 INCH WAFER
29,659
PRINCIPAL DEVICE TYPES
CMUT5401
CMPT5401
CXT5401
BACKSIDE COLLECTOR
w w w. c e n t r a l s e m i . c o m
R2 (22-March 2010)