CP714V Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – Small Signal Transistor PNP - Low Noise Amplifier Transistor Chip

PROCESS CP714V
Small Signal Transistor
PNP - High Current Transistor Chip
PROCESS DETAILS
Process
Die Size
Die Thickness
Base Bonding Pad Area
Emitter Bonding Pad Area
Top Side Metalization
Back Side Metalization
GEOMETRY
EPITAXIAL PLANAR
40 x 40 MILS
7.0 MILS
7.9 x 8.7 MILS
9.0 x 14 MILS
Al - 30,000Å
Au - 18,000Å
GROSS DIE PER 5 INCH WAFER
10,583
PRINCIPAL DEVICE TYPES
CBCP69
CBCX69
CZT751
MPS750
MPS751
w w w. c e n t r a l s e m i . c o m
R0 (17-November 2010)